Patents of Chiplus. 

February 21, 2005: patent no. M257513 - a structure of chip stack package

September 11, 2005 : patent no. M275536 - a kind of memory package
                                   (WSON)

November 1, 2005: patent no. I242873 - integrated circuit packaging method and
                                structure for redistributing configuration thereof

December 21, 2006: patent no. M303585 - Method and structure for fabricating circuit board via wafer